Stress Engineering Services uses Digital Image Correlation (DIC) to monitor and measure three-dimensional full-field deformations and strains. This non-contact optical technique can measure displacements and strains on almost any material with high accuracy. Our DIC system can be used to supplement or replace large numbers of strain gauges and other measurement devices used in full-scale testing programs.
Digital Image Correlation is a 3D, full-field, optical technique to measure deformation and strain on almost any material via tracking of grey value patterns. A stochastic pattern is applied to the surface of the test article. Two cameras are then used to capture images of the test article before, during, and after the testing process. Advanced software then calculates the movement of the unique surface patterns and determines the 3D surface coordinates by using stereo-triangulation.
Digital Image Correlation can also be utilized for discrete point tracking. Discrete target dots are placed on the object and the system tracks the location of the dots using the same technique used for the stochastic pattern tracking.
The Digital Image Correlation software can output the following point tracking measurements in 6 degrees of freedom:
We have the following capabilities at Stress Engineering Services that we use in conjunction with DIC:
Enhancing Finite Element Analysis with Digital Image Correlation Test Data
Presenter: Matthew Sanders, PE
If you would like more information on Stress Engineering Services, please call us at 281.955.2900, or complete the following form and one of our representatives contact you shortly. For a complete listing of contact information, visit our Locations page.
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